KUALA LUMPUR 23rd International Conference on “Innovations in Science, Engineering & Technology” (ICISET-23) May 31-June 2, 2023 Kuala Lumpur (Malaysia)
Please Download FINAL Program at given link: https://we.tl/t-cVdKyfSmnY
Poster Presentation Instruction: Please print the Poster of ONLY A1 size (Portrait) 59.4 x 84.1 cm on light weight paper and bring the printed poster at the time of registration to the conference Venue
Please Note: The Whole program is on June 1, 2023 (Registartion + All Presentataions)
Deadline of New Full Paper/Poster/Abstract Submissions ----- May 1, 2023 (Late Round)
The idea of KUALA LUMPUR 23rd International Conference on “Innovations in Science, Engineering & Technology” (ICISET-23) scheduled on May 31- June 2, 2023 Kuala Lumpur (Malaysia) is for the researchers, scientists, scholars, engineers and practitioners from all around the world to present and share ongoing research activities. This conference provides opportunities for the delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration.
- Oral Presentation at Conference Venue (in Physical Presence)
- Poster Presentation at Conference Venue (in Physical Presence)
- ONLINE (video presentation with WhatsApp/viber/Skype)
- OFFLINE (creating PowerPoint presentation without/with recorded voice for conference participants)
All registered papers will be online at ISBN DOI Indexed Conference Proceedings OR in the ISSN journals.
SCOPUS / World of Science-ESCI Indexed Journals (OPTIONAL): All registered papers can be published online in the SCOPUS or World of Science-ESCI Indexed Journal with additional charges.
All full paper submissions will be peer reviewed and evaluated based on originality, technical and/or research content/depth, correctness, relevance to conference, contributions, and readability. One Best Presenation Award from each session will also be distributed at the time of the conference.
All accepted papers of ICISET-23 will be published in the printed conference proceedings with valid International ISBN number. Each Paper will be assigned unique Digital Object Identifier (DOI) from CROSSREF and the Proceedings of the Conference will be archived in HEAIG's Engineering & Technology Digital Library. The Proceeding will be also submitted to SCOPUS/ISI Thomson for review. In addition the proceedings will be indexed at all major search engines.
English is the official language of the conference. We welcome paper submissions. Prospective authors are invited to submit full (and original research) papers (which is NOT submitted or published or under consideration anywhere in other conferences/journal) in electronic (DOC or PDF) format alongwith the contact information.
1. Email: firstname.lastname@example.org
2. Electronic Submission System ( .doc/.docx/.pdf formats)
Prospective authors are kindly invited to submit full text papers including results, tables, figures and references. Full text papers (.docx, .doc, .pdf) will be accepted by Electronic Submission System. Any question, please contact: email@example.com
The following are the links to the HEAIG copyright form as well as the HEAIG conference's/Journal's template for the Camera ready Paper/Final paper:
- HEAIG Copyright Form
- HEAIG Conference .doc/.docx Template
- HEAIG Conference .doc/.docx Template ONLY Abstract
There are NO specific instructions for poster preparation. Please print the poster of A1 size (portrait) on light weight paper and bring the printed poster at the time of the registration to the conference venue.
For any inquiry about the submission and conference, please feel free to contact us at: firstname.lastname@example.org
All submitted articles should report original, previously unpublished research results, experimental or theoretical. Articles submitted to the Conference should meet these criteria and must not be under consideration for publication elsewhere. Manuscripts should follow the style of the Conference and are subject to both review and editing.
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