Call for papers

Full Articles/ Reviews/ Shorts Papers/ Abstracts are welcomed in the following research fields:

Core Engineering Disciplines:

  • Civil Engineering:
    • Resilient infrastructure development (buildings, transport, water systems).
    • Sustainable construction materials and practices.
    • Smart cities and urban planning.
    • Transportation engineering and traffic management.
    • Water resources engineering and management.
    • Structural engineering and earthquake resistance.
    • Environmental engineering and pollution control.
    • Geotechnical engineering and soil mechanics.
  • Mechanical Engineering:
    • Advanced manufacturing and materials processing.
    • Robotics and automation in manufacturing.
    • Thermal engineering and heat transfer.
    • Design and analysis of mechanical systems.
    • Mechatronics and control systems.
    • Automotive engineering and electric vehicles.
    • Aerospace engineering and aerodynamics.
    • Energy systems and renewable energy technologies.
  • Electrical Engineering:
    • Power systems and smart grids.
    • Renewable energy integration.
    • Electronics and microelectronics.
    • Control systems and automation.
    • Signal processing and analysis.
    • Telecommunications and networking.
    • Embedded systems design.
    • Photonics and optoelectronics.
  • Chemical Engineering:
    • Sustainable chemical processes and green chemistry.
    • Biochemical engineering and biotechnology.
    • Materials science and engineering.
    • Process design and optimization.
    • Reaction engineering and catalysis.
    • Pharmaceutical engineering.
    • Polymer science and engineering.
    • Environmental chemical engineering.
  • Computer Engineering:
    • Artificial intelligence and machine learning.
    • Computer architecture and organization.
    • Software engineering and development.
    • Cybersecurity and data privacy.
    • Networking and distributed systems.
    • Internet of Things (IoT) and sensor technologies.
    • Cloud computing and big data analytics.
    • Human-computer interaction.
  • Industrial Engineering:
    • Operations research and optimization.
    • Supply chain management and logistics.
    • Manufacturing systems and process improvement.
    • Ergonomics and human factors engineering.
    • Quality control and reliability engineering.
    • Systems engineering and integration.
    • Healthcare systems engineering.
    • Financial engineering.
  • Materials Engineering:
    • Advanced materials and nanomaterials.
    • Materials characterization and testing.
    • Composites and hybrid materials.
    • Corrosion and surface engineering.
    • Biomaterials and medical device materials.
    • Sustainable materials and recycling.
    • Additive manufacturing (3D printing) of materials.
    • Computational materials science and engineering.
  • Biomedical Engineering:
    • Medical imaging and instrumentation.
    • Tissue engineering and regenerative medicine.
    • Biomechanics and rehabilitation engineering.
    • Biomaterials and drug delivery systems.
    • Artificial organs and prosthetics.
    • Clinical engineering and healthcare technology management.
    • Bioinformatics and computational biology.
    • Neural engineering.

Emerging and Interdisciplinary Topics:

  • Artificial Intelligence (AI) and Machine Learning (ML): Applications across all engineering disciplines, including design, automation, optimization, and prediction.
  • Internet of Things (IoT): Smart devices, sensor networks, data analytics for various engineering applications.
  • Robotics and Automation: Advanced robotics, human-robot interaction, autonomous systems.
  • Sustainable Technology: Green engineering, renewable energy, waste management, environmental protection.
  • Cybersecurity: Protecting engineering systems, infrastructure, and data from cyber threats.
  • Data Science and Big Data Analytics: Utilizing large datasets for engineering design, optimization, and decision-making.
  • Augmented Reality (AR) and Virtual Reality (VR): Applications in design, training, simulation, and visualization.
  • Quantum Computing: Potential applications in materials science, optimization, and cryptography.
  • Edge Computing: Distributed computing for real-time data processing in engineering applications.
  • Digital Twins: Virtual representations of physical assets for monitoring, simulation, and optimization.
  • Nanotechnology: Applications in materials, electronics, medicine, and energy.
  • Biotechnology: Applications in medicine, agriculture, and materials science.
  • Space Technologies: Aerospace engineering, satellite systems, space exploration.
  • Additive Manufacturing (3D Printing): Rapid prototyping, custom manufacturing, novel materials.
  • Human Augmentation: Wearable technology, bionics, and technologies that enhance human capabilities.
  • Smart Materials: Materials with properties that change in response to external stimuli.
  • Energy Storage: Batteries, fuel cells, and other energy storage technologies.
  • Disaster Resilience: Engineering solutions for mitigating the impact of natural and human-made disasters.
  • Engineering Education: Innovative teaching methods, online learning, and preparing future engineers for emerging challenges.
  • Ethics in Engineering and Technology: Addressing the societal and ethical implications of new technologies.

Current Trends in Technology that will likely influence conference topics:

  • Generative AI: Creating new content (text, images, code) with potential impacts on design and automation.
  • 5G and Beyond: Faster and more reliable wireless communication enabling advanced applications.
  • Blockchain Technology: Applications in supply chain, security, and data management.
  • Cloud Computing: Scalable and flexible computing resources for engineering tasks.
  • Autonomous Vehicles: Advancements in transportation and logistics.
  • Biotechnology in Agriculture: Enhancing crop yields and sustainability.
  • Wearable Technology: Integration of sensors and computing into everyday objects for health monitoring and other applications.